Development Engineer Packaging / PCB Assembly (m/f/d)

Einsatzort: Hamburg

Nexperia is a world-class company in semiconductor development and in-house production. A proven global player with an entrepreneurial mentality. At our core is an 11,000+ strong international network with a singular focus. Built on passion and commitment to our work, belief in our goals and a drive to succeed regardless of the challenges we face. We support, reward and challenge individuals equally, in a dynamic and energetic environment.

Looking to push boundaries in a company where your talents can shine? Join TeamNexperia.

Development Engineer Packaging / PCB Assembly (m/f/d)

What you will do

  • Support R&D project teams with package architect expertise
  • Interfacing to global package and assembly development community
  • Collect technical market trends, customer needs and benchmarking information concerning packages and PCB assembly. Propose own
  • innovative solutions
  • Support all Business Group functions with package & PCB board assembly expertise
  • Pro-active Package Requirements Management and road-mapping derived from product roadmaps and market trends

What you will need

  • University degree in Semiconductor Packaging, Physics, Materials Technology, Electronics Engineering or similar
  • First years of experience in packaging development or related PCB board assembly
  • Strong skills in architectural thinking and structured problem solving
  • Excellent communication skills and team player within global, intercultural environment
  • Fluent Business English
  • Energetic and result driven, ambition to grow

More information?

For more details please contact: john.perez@nexperia.com

Treffen Sie uns auf der T5 JobMesse am 16.10.2019 in Hamburg

Eintritt frei. Mehr Info und Anmeldung hier!